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 Job Information 
  Job Title: Process Development Engineer - Wafer Fab
  Category: Engineering
  Career Center: Cree; Cree Internal
  City/Town: Durham
  Country: United States
  Location: Cree, Inc.
  Type of Assignment: Regular
  Position Type: Full Time


 Job Description 
   
 

SUMMARY:

Cree is looking for a self-motivated, hands-on, process development engineer to become a member of the R & D team responsible for the development, design, and fabrication of LED chips for customers. This position will also involve process development on new equipment platforms as well as improvements to existing processes. The successful candidate will be a resourceful problem solver with the capacity to quickly grasp and resolve a wide range of technical issues through the implementation of practical solutions to complicated problems.

RESPONSIBILITIES:

  1. Work with team of scientists, engineers, and technicians to develop chip fabrication processes for III-N based LEDs.
    Develop processes for LED chip fabrication on new equipment platforms.
  2. Transfer new processes and equipment to high volume manufacturing sites both domestic and international as required. Extended travel periods of up to 6 weeks if required.
  3. Domestic and international travel as required to work with equipment suppliers, including possible extended periods of travel in support of process development needs either at supplier sites or other Cree manufacturing sites.

MINIMUM QUALIFICATIONS:

  • B.S., M.S., or Ph.D. in Materials Science, Engineering, or Physical Science.
  • Willing to work diligently with minimal guidance and to develop habits in-line with the Cree culture (be a team player, dedicated, willing to work outside the scope of normal job duties and past experience, and have ‘whatever-it-takes’ attitude).
  • Excellent verbal and written communication skills, including technical writing for summarizing data and finding, writing process and equipment specifications and work instructions.

PREFERRED QUALIFICATIONS:

  • Familiarity with and the ability to learn and perform as necessary all tasks related to LED processing, which, as a minimum, include the following: dry and wet etching, metal and dielectric deposition, photolithography, mask layout and design, electrical and optical device characterization, and SEM (and related techniques) analysis.
  • Strong working knowledge of SPC and DOE principles and methods.
  • Familiarity with Access and JMP.
  • Optoelectronic device experience a very strong plus, but recent graduates are encouraged to apply.



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