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 Job Information 
  Job Title: Packaging Development Engineer
  Category: Engineering
  Career Center: Cree; Cree Internal
  City/Town: Research Triangle Park
  Country: United States
  Location: Cree, Inc.
  Type of Assignment: Regular
  Position Type: Full Time


 Job Description 
   
 

Are you someone who thrives on coming up with dynamic solutions that help a company grow?  Do you want to be a part of a company that is revolutionizing the lighting industry?  Would you like to help enable a green technology that could help solve some of the world’s energy problems?  If so, Cree could be the place for you.  We are a fast-growing semiconductor company that is leading the LED lighting revolution and setting the stage to obsolete the incandescent light bulb through the use of energy-efficient, environmentally friendly LED lighting.

We are headquartered in Raleigh/Durham, NC; an area consistently ranked in the Top 10 Places to Live by Money Magazine and home to the Research Triangle Park (RTP).  The RTP area was recently voted the #1 high-tech region in the country by the Silicon Valley Leadership Group and was also recognized as the #1 Best City for Jobs by Forbes magazine.   RTP is home to a broad spectrum of companies -- from Fortune 100 multinationals, to university spin-outs and start-up operations.  Cree’s North Carolina facilities are home to approximately 1600 full-time employees devoted to R&D, manufacturing, sales & marketing and other professional support roles.

Cree boasts a casual work environment, where jeans and shorts are a typical sight every day.  We also have a free full-service onsite fitness facility.  Our benefits include a quarterly bonus program, stock options, 401k, Employee Stock Purchase Plan, tuition reimbursement, and medical/vision/dental coverage.

We currently have an opening for a Packaging Engineer in our Power & RF group.  This position will be stationed at our Research Triangle Park facility in NC.

Job Description

We are seeking an experienced Packaging Engineer to develop new discrete packaging solutions for high voltage, high power silicon carbide electronic devices.  SiC power devices are able to extend the operating ranges of voltage, temperature and power density beyond the capabilities of most conventional high volume packaging technologies.  This individual will work closely with R&D device scientists and product engineers to develop new families of high power electronic devices.

Responsibilities:

  • Lead technical contributor and owner of programs that will introduce industry changing SiC packaging solutions
  • Program ownership of new packaging solutions from inception to mass production
  • Transfer of new packaging offers from product development to outsourced assembly and test partners
  • Drive, characterize, develop and implement new packaging solutions meeting cost, manufacturability, quality and reliability requirements
  • Re-engineer and optimize existing direct materials to meet new industrial and legislative requirements
  • Conduct competitive benchmarking, review patent literature, filing of invention disclosures and patents to protect Cree intellectual property.

Key Attributes:

  • Desire to work in a “hands on” product development environment
  • Passion for releasing products that generate commercial success
  • Vision to fundamentally change the power semiconductor industry

Requirements:

  • BS degree in Mechanical Engineering, Material Science or related field
  • 7-10 years relevant experience with specific history in electronic package development
  • Experience in finite element modeling
  • Working knowledge of power semiconductor encapsulants and mold compounds
  • Expertise in thermal analysis and modeling tools
  • Excellent semiconductor package materials knowledge
  • Intimately familiar with existing power semiconductor devices including diodes, MOSFETs, IGBTs,etc.
  • Knowledge of industry “green” initiatives, (ie. RoHS, Wee, Pb Free, Halogen Free, etc.)
  • Strong project management and communication skills
  • Experience with outsourced semiconductor assembly and test
  • Established network of information sources
  • Available to travel internationally 10-15% of time

Preferences

  • Master’s level degree in a related discipline is preferred
  • Cross functional experience, preferably in a manufacturing capacity

If what you’ve read sounds exciting to you, then we encourage you to apply online.  This action will send an email directly to the recruiter associated with this opening.  We actually do review every resume that comes in and will contact you directly if we think you’re a potential match.  Our application process takes only 5-10 minutes and our recruiting team will contact you with one week if you are going to be considered further.




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